By Jaime Aguilera
Design and attempt of built-in Inductors for RF Applications is meant for engineers who're beginning out within the layout of built-in inductors, this considering that it describes the complete layout stream, uncomplicated choice of the geometry, optimisation of the standard through remodeling the geometry, dimension and de-embedding and characterisation. Secondly it is going to aid the dressmaker with a lot event during this box, this on account that, in accordance with empirical info, a few layout ideas which were known by way of the layout neighborhood were proved to be quite conservative and breaking them leads as much as larger caliber designs.
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Extra resources for Design and Test of Integrated Inductors for RF Applications
Therefore, the value of the inductance will decrease, since the inductance is defined as the ratio between the magnetic flux and the current in the spiral [Cran97]. 2 Electrically induced parasitic effects in the substrate Other parasitic effect that shows up in Silicon integrated inductors is the capacitative coupling between the inductor and the substrate. The reader can understand this effect by realizing that a capacitor is just two conductive Design and test of integrated inductors for RF applications 39 plates (metallic layer form by the inductor and semiconductor substrate) separated by a dielectric (Silicon oxide), as shown in Figure 2-16.
The spiral is built by using one of the metal layers embedded in silicon oxide and placed at some distance from the semiconductor substrate. As it is shown in Figure 2-8, when a time-varying voltage is applied between the ends of the spiral, three electrical and one magnetic field are generated. In what follows the reasons for the generation of theses fields and their effects on the behavior of the spiral are explained. Magnetic field B(t): Any time-variant current flowing along a conductor induces a magnetic field.
The different loss mechanisms are shown in Figure 1-13 and explained in the following paragraphs [Nik00]. It is necessary to mention that in chapter 4 of this book all these effects are analyzed with greater depth. The objective of this section is only to introduce the difficulty that entails the integration of RF passive elements in conventional Si based low cost technologies. 1 Metal losses The passive elements generally make use of one or more metallization layers. For example, an inductor is made up of one or more metal tracks in parallel forming one or several concentric turns.
Design and Test of Integrated Inductors for RF Applications by Jaime Aguilera